hlmp-fw00 5mm flat top ingan white led lamp data sheet description this wide viewing angle white led lamp is based on ingan material technology. a blue led die is coated by a phosphor to produce white. the typical resulting color is described by the coordinates x = 0.32, y = 0.32 using the 1931 cie chromaticity diagram. beneft ? reduced power consumption, higher reliability, and increased optical/mechanical design flexibility compared to incandescent bulbs and other alternative white light sources features wide viewing angle: 90 ? flat top ? high intensity ingan technology applications ? electronic signs and signals ? small area illumination ? legend backlighting ? general purpose indicators caution : these devices are class 1c esd sensitive. please observe appropriate precautions during handling and processing. refer to avago technologies application note an-1142 for additional details. package dimensions notes : 1. all dimensions are in milimetres /inches. 2. epoxy meniscus may extend about 1mm (0.040) down the leads.
absolute maximum ratings (t a = 25 c) parameter value units dc forward current [1] 30 ma peak forward current [] 100 ma power dissipation 111 mw reverse voltage (ir = 10 m a) 5 v led junction temperature 110 c operating temperature range -40 to +85 c storage temperature range -40 to +100 c notes: 1. derate linearly as shown in figure 5. 2. duty factor 10%, 1 khz. electrical characteristics (t a = 25 c) forward voltage v f (v) @ i f = 20 ma reverse breakdown v r (v) @ i r = 10 m a capacitance c (pf), v f = 0,f = 1 mhz thermal resistance r q j-pin ( c/w) typ. max. min. typ. typ. 3. 3.7 5 70 40 optical characteristics (t a = 25 c) typical chromaticity coordinates [1] viewing angle 2 q 1/2 degrees [2] typ. x y 0.3 0.3 90 notes: 1. the chromaticity coordinates are derived from the cie 1931 chromaticity diagram and represent the perceived color of the device. 2. q 1/2 is the of-axis angle where the luminous intensity is ? the peak intensity. device selection guide part number min luminous intensity iv (mcd) @ 20ma max luminous intensity iv (mcd) @ 20ma HLMP-FW00-JM0XX 40 680 tolerance for intensity bin limit is +/-15%
3 wavelength ? nm relative luminous intensity 380 780 1.0 0.6 0 680 580 480 0.4 0.8 0.2 0 1.5 0.3 relative luminous intensity forward current - ma 1.2 0.9 0.6 -0.010 0.025 0 0.005 -0.005 y-coordinates x-coordinates (x,y) values @ 20 ma reference to (0,0) -0.004 0.004 -0.002 30 ma 5 ma 1 ma 0 0.002 0.015 0.010 0.020 25 ma 20 ma 15 ma 10 ma forward current - ma 0 forward voltage - v 20 15 35 30 5 10 25 i f max. - maximum forward current - ma 0 0 t a - ambient temperature - c 40 80 35 30 10 20 60 100 15 25 5 20 0 3 0 20 10 0 4 3 2 1 0. 0 0. 5 1. 0 -9 0 - 60 -3 0 0 30 60 90 angular displacement - degree relative luminous intensity figure 1. relative intensity vs wavelength figure 2. forward current vs forward voltage figure 3. relative iv vs. forward current figure 4. chromaticity shift vs. current figure 5. maximum fwd. current vs temperature figure 6. spatial radiation pattern
4 color bin limit tables rank limits (chromaticity coordinates) 1 x y 0.330 0.360 0.330 0.318 0.356 0.351 0.361 0.385 x y 0.87 0. 95 0.96 0.76 0.330 0.318 0.330 0.339 3 x y 0.64 0.67 0.80 0.48 0.96 0.76 0.83 0.305 4 x y 0.83 0.305 0.87 0.95 0.330 0.339 0.330 0.360 tolerance for each bin limit is 0.01 0.20 0.25 0.30 0.35 0.40 0.26 0.3 0.34 0.38 x-coordinate y-coordinate 1 2 3 4 black body curve note: 1. bin categories are established for classifcation of products. products may not be available in all bin categories. please contact your avago representative for information on currently available intensity bin limits (mcd at 20 ma) bin min. max. j 40 310 k 310 400 l 400 50 m 50 680 tolerance for each bin limit is 15% color bin limits with respect to cie 1931 chromaticity diagram relative light output vs. junction temperature 0 1.2 1.0 relative light output (normalized at t j = 25 c) t j - junction temperature - c -40 1.4 0.8 -20 0 2 0 4 0 6 0 120 80 100 0.2 0.4 0.6
5 precautions: lead forming: ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. ? if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. ? it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering condition: ? care must be taken during pcb assembly and soldering process to prevent damage to led component. ? the closest led is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standof. ? recommended soldering condition: wave soldering manual solder dipping pre-heat temperature 105 c max. - preheat time 30 sec max - peak temperature 50 c max. 60 c max. dwell time 3 sec max. 5 sec max ? wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. customer is advised to periodically check on the soldering profle to ensure the soldering profle used is always conforming to recommended soldering condition. ? if necessary, use fxture to hold the led component in proper orientation with respect to the pcb during soldering process. ? proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 25?c before handling. ? special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. ? recommended pc board plated through holes led component ead size diagonal plated through hole diameter 0.457 x 0.457mm (0.018 x 0.018inch) 0.646 mm (0.05 inch) 0.976 to 1.078 mm (0.038 to 0.04 inch) 0.508 x 0.508mm (0.00 x 0.00inch) 0.718 mm (0.08 inch) 1.049 to 1.150mm (0.041 to 0.045 inch) note: refer to application note an1027 for more information on soldering led components. recommended wave soldering profle bottom side of pc board top side of pc board note: allow for boards to be sufficiently cooled before exerting mechanical force. conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150 c (100 c pcb) solder wave temperature = 245 c air knife air temperature = 390 c air knife distance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma 250 200 150 fluxing turbulent wave preheat time - seconds temperature - c 100 50 30 0 1 0 2 0 3 0 4 0 5 0 6 0 7 0 8 0 9 0 1 00 laminar wave hot air knife
disclaimer: avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or appli - cations. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies, limited in the united states and other countries. data subject to change. copyright ? 007 avago technologies limited. all rights reserved. obsoletes 5989-4143en av0 -04 5en - may 15, 007
|
